- All sections
- C - Chemistry; metallurgy
- C23C - Coating metallic material; coating material with metallic material; surface treatment of metallic material by diffusion into the surface, by chemical conversion or substitution; coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general
- C23C 18/54 - Contact plating, i.e. electroless electrochemical plating
Patent holdings for IPC class C23C 18/54
Total number of patents in this class: 292
10-year publication summary
26
|
42
|
21
|
30
|
20
|
15
|
14
|
14
|
15
|
4
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Atotech Deutschland GmbH | 586 |
25 |
MacDermid Enthone Inc. | 237 |
7 |
GM Global Technology Operations LLC | 13620 |
6 |
Lam Research Corporation | 4775 |
6 |
BYD Company Limited | 3700 |
6 |
Mitsubishi Electric Corporation | 43934 |
5 |
C. Uyemura & Co., Ltd. | 156 |
5 |
Toyota Motor Corporation | 28582 |
4 |
FUJIFILM Corporation | 27102 |
4 |
MacDermid Acumen, Inc. | 162 |
4 |
Toyo Kohan Co., Ltd. | 413 |
4 |
Rtx Corporation | 8674 |
4 |
International Business Machines Corporation | 60644 |
3 |
BASF AG | 1258 |
3 |
Tokyo Electron Limited | 11599 |
3 |
Fuji Electric Co., Ltd. | 4750 |
3 |
Ebara Corporation | 1951 |
3 |
Alchimer | 52 |
3 |
Nanogate AG | 18 |
3 |
Nanyang Technological University | 1739 |
3 |
Other owners | 188 |